Lebitla la litaemane tsa Viitried Bond Grindling la Slinding Silicon Wafer

Tlhaloso e khutšoane:

Mabili a botlokotse a mokokotlo a sebelisoa haholo bakeng sa ho theola le ho silila ha silicon se setle haholo. Lihlahisoa tsena li thehiloe ke setheo sa rona tse nang le ts'ebetso e phahameng ea ho ngola le litšenyehelo tse phahameng.
Ts'ebetso ke e 'ngoe ea boemo bo holimo lefatšeng ka bophara. Li ka sebelisoa le Majapane, Amerika, American, American, oa Korea le Grinders ea Sechaena.


Lintlha tsa sehlahisoa

Li-tag tsa lihlahisoa

Mochini o ka morao oa bond
Letoto lena la daemane la daemane le sebelisoa haholo bakeng sa ts'ebetso e fokotsehileng le e hlakileng ea lisebelisoa tsa semiconductor, li ile tsa hokahana le likheo tsa Silika.
Resin Bond Band Band Grind Wheel
Lebili la Resing Band Mabili a Band

Mohlala
D (mm)
T (limilimithara)
H (mm)
6a2 / 6a2h
175
30, 35
76
200
35
76
350
45
127
6a2t
195
22.5, 25
170
280
30
228.6
6a2t (ellipsese e meraro)
350
35
235
209
22.5
158
Litlhaloso tse ling li ka hlahisoa ho latela tlhokahalo ea bareki.

Melemo ea mabili a morao a bolila
1. Ka tšenyo e tlase le boleng bo holimo
Ts'ebetso ea 2.Nadio e thibelang
3. E thusa ho fokotsa tšenyo ea ho sebetsa, ho ntlafatsa ts'ebetso ea ho sebetsa le ho fokotsa litšenyehelo tsa ts'ebetso, 'me e ka tsamaisoa ho latela litlhoko tsa bareki

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1.Pologanalo ea letsatsi le morao la granding:
Khutlela ho nyenyefatse, ho grandite e kopaneng e ntle, sepakapaka sa silika, silise, chips, li-chiniche tse thehiloeng ho silino
2. Pokello ea Mesebetsi e Sehlōhō
3. Lisebelisoa tsa Mesebetsi: Monocrystalline silicon, Gallium Phosside, Silicon Carbide le lisebelisoa tse ling tsa semicondorne le lisebelisoa tse ling tsa semicondor.
4. Likopo: Back sosing, ho silakanya ho tsitsinya
Mochine oa ho silila: mabili a botlokoli a morao-rao a ka sebelisoa bakeng sa Sejeremane sa Majapane, Amerika, Sejeremane sa Majapane, Sejeremane le NTS, Shran le Crandbau, TST).

Mabili a morao-rao (3)

  • E fetileng:
  • E 'ngoe: