Mochini o ka morao oa bond
Letoto lena la daemane la daemane le sebelisoa haholo bakeng sa ts'ebetso e fokotsehileng le e hlakileng ea lisebelisoa tsa semiconductor, li ile tsa hokahana le likheo tsa Silika.
Resin Bond Band Band Grind Wheel
Lebili la Resing Band Mabili a Band
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Melemo ea mabili a morao a bolila
1. Ka tšenyo e tlase le boleng bo holimo
Ts'ebetso ea 2.Nadio e thibelang
3. E thusa ho fokotsa tšenyo ea ho sebetsa, ho ntlafatsa ts'ebetso ea ho sebetsa le ho fokotsa litšenyehelo tsa ts'ebetso, 'me e ka tsamaisoa ho latela litlhoko tsa bareki


1.Pologanalo ea letsatsi le morao la granding:
Khutlela ho nyenyefatse, ho grandite e kopaneng e ntle, sepakapaka sa silika, silise, chips, li-chiniche tse thehiloeng ho silino
2. Pokello ea Mesebetsi e Sehlōhō
3. Lisebelisoa tsa Mesebetsi: Monocrystalline silicon, Gallium Phosside, Silicon Carbide le lisebelisoa tse ling tsa semicondorne le lisebelisoa tse ling tsa semicondor.
4. Likopo: Back sosing, ho silakanya ho tsitsinya
Mochine oa ho silila: mabili a botlokoli a morao-rao a ka sebelisoa bakeng sa Sejeremane sa Majapane, Amerika, Sejeremane sa Majapane, Sejeremane le NTS, Shran le Crandbau, TST).
